Circuit board

The invention provides a circuit board. The circuit board comprises an insulation substrate and multiple copper coil rings arranged on the insulation substrate. The insulation substrate comprises a bottom surface and is provided with at least one columns of through holes, the multiple copper foil rings are arranged on the bottom surface, each copper foil ring is coaxially arranged with one through hole, and the inner diameter of each copper foil ring is the same as the diameter of the corresponding through hole. The circuit board further comprises an insulation solder mask covering the bottom surface and the multiple copper foil rings. The solder mask is provided with multiple solder mask windows, and each solder mask window is circular-hole-shaped and is coaxially arranged with one through hole. The circuit board is additionally provided with the insulation solder mask, and the insulation solder mask is enabled to cover copper foil, such that the adhesive power between the copper foil and the substrate is enabled to be enhanced, and short circuits among metal terminals of plug-ins during soldering is prevented.