Semiconductor package piece and manufacturing method thereof

The invention provides a semiconductor package piece and a manufacturing method thereof. The semiconductor package piece comprises a first substrate, an electrical connection component, a package body, a second substrate, a conductive column, an electrical contact and a bonding layer. The electrical...

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Bibliographische Detailangaben
Hauptverfasser:	SUN DEKAI, CHEN YITING, HUANG SHIMING, LIN JUNHONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention provides a semiconductor package piece and a manufacturing method thereof. The semiconductor package piece comprises a first substrate, an electrical connection component, a package body, a second substrate, a conductive column, an electrical contact and a bonding layer. The electrical connection component is formed on the first substrate. The package body coats the electrical connection component and is provided with an opening, and the electrical contact is exposed out of the opening. The second substrate is provided with a first surface and a second surface opposite to the first surface. The conductive column is formed on the first surface of the second substrate and is electrically connected to the electrical connection component. The electrical contact is formed on the second surface of the second substrate and is electrically connected to the conductive column. The bonding layer is formed between the surface of the package body and the second substrate and surrounds the conductive column and electrical connection component.