Semiconductor device and method for fabricating the same

The invention discloses a semiconductor device and a method for fabricating the same. The semiconductor device may include first and second fins formed side by side on a substrate, a first elevated doped region formed on the first fin and having a first doping concentration of impurities, a second e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM SEOK-HOON, SONG WOO-BIN, KOO BON-YOUNG, LEE BYEONGAN, KIM NAM-KYU, JUNG SU-JIN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention discloses a semiconductor device and a method for fabricating the same. The semiconductor device may include first and second fins formed side by side on a substrate, a first elevated doped region formed on the first fin and having a first doping concentration of impurities, a second elevated doped region formed on the second fin, and a first bridge connecting the first elevated doped region and the second elevated doped region to each other. Methods of manufacturing such a semiconductor device are also disclosed.