TO-126 type package component

TO-126 type package component

The invention relates to a TO-126 type package component. The TO-126 type package component comprises a substrate; a circular-arc-shaped hole is formed in the substrate and a chip mounting region is formed on the substrate; the area of the circular-arc-shaped hole is greater than the rear of a semic...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHU JIANZHOU, XIA HUAQIU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention relates to a TO-126 type package component. The TO-126 type package component comprises a substrate; a circular-arc-shaped hole is formed in the substrate and a chip mounting region is formed on the substrate; the area of the circular-arc-shaped hole is greater than the rear of a semicircle, and the center of the hole is located in the substrate. The area of the chip mounting region on the TO-126 type package is twice or above the area of a chip mounting region adopted in the past.