Equipment and method for detecting noncontact scanning polished wafer surface roughness

The invention provides equipment and a method for detecting noncontact scanning polished wafer surface roughness. The method includes that a light scattering principle is utilized to detect the edges of silicon wafers and particles on the surfaces of the silicon wafers; in the process of detection, wafer fetching and classified placing of the silicon wafers are performed through a manipulator, so that automated control is realized; a detection image and a set of data corresponding roughness of the silicon wafers are formed after detection is completed, so that a detector can acquire information of the silicon wafers more visually, simply and conveniently.