Chip diode encapsulated component and manufacturing method thereof

The invention discloses a chip diode encapsulated component and a manufacturing method thereof. The chip diode encapsulated component has no outer pin, and comprises a sealing adhesive coating one or more diode chips therein, wherein the bottom and the top of each diode chip are connected to two lea...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG XINGXIANG, HUANG XINGCAI, XU HONGZONG, LIAN QINGHONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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