Chip diode encapsulated component and manufacturing method thereof

The invention discloses a chip diode encapsulated component and a manufacturing method thereof. The chip diode encapsulated component has no outer pin, and comprises a sealing adhesive coating one or more diode chips therein, wherein the bottom and the top of each diode chip are connected to two lead frames in 180-degree reflection respectively. Except for inner electrodes forming the chip diode encapsulated component, each diode chip forms electrical contact with outer electrodes at two sides out of the sealing adhesive, so that each diode chip generates a semiconductor diode characteristic by virtue of the structure. The manufacturing method of the chip diode encapsulated component utilizes a lead-free process, and prepares the hip diode encapsulated component having no outer pin. The manufacturing method can meet various international environment requirements, can not only overcome the problem of size precision of the outer pin but also increase encapsulation speed and encapsulation stability.