Real-time membrane thickness modification plate for vacuum membrane plating and control method of real-time membrane thickness modification plate
The invention relates to a real-time membrane thickness modification plate for vacuum membrane plating and a control method of the real-time membrane thickness modification plate, for mainly solving the technical problems that a conventional membrane thickness modification plate is large in plating...
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Zusammenfassung: | The invention relates to a real-time membrane thickness modification plate for vacuum membrane plating and a control method of the real-time membrane thickness modification plate, for mainly solving the technical problems that a conventional membrane thickness modification plate is large in plating membrane material waste, the membrane plating is not uniform and the product quality is poor. According to the technical scheme, the real-time membrane thickness modification plate for vacuum membrane plating comprises a membrane thickness modification plate bracket as well as a rotation membrane thickness modification plate, a rotating device and a fixed membrane thickness modification plate, wherein the fixed membrane thickness modification plate is arranged on one side of the membrane thickness modification plate bracket; a rotary guide track is arranged on the membrane thickness modification plate; the rotating membrane thickness modification plate is arranged above the fixed membrane thickness modification plate and a guide column arranged on the rotating membrane thickness modification plate is positioned in the rotary guide track; the rotating device is arranged on the fixed membrane thickness modification plate and is positioned on one side of the rotating membrane thickness modification plate. The control method of the real-time membrane thickness modification plate comprises steps of comparing the membrane plating velocity of a main monitoring point and an auxiliary monitoring point, and achieving rapid real-time membrane thickness distribution modification under the condition that the stable membrane plating velocity at the main monitoring point is ensured. |
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