High-temperature semicoke cooling device based on air distributor structure

The invention provides a high-temperature semicoke cooling device based on an air distributor structure. The high-temperature semicoke cooling device comprises a closed vertical furnace which is provided with a feeding hole and a discharge hole, wherein a feeding mechanism for conveying high-temperature semicoke is arranged in the vertical furnace; the feeding mechanism comprises at least two vertical baffle plates which are distributed up and down slantwise and symmetrically; a bed layer is arranged slantwise between two adjacent vertical baffle plates; the bed layer is composed of a plurality of air distributors which are orderly arranged up and down at intervals in a staggered way; a vertical channel formed by use of the vertical baffle plate at the topmost end and the inner sidewall of the vertical furnace is communicated with the feeding hole; an air inlet for introducing cooling air is formed in the lower end of the vertical furnace; an air outlet is formed in the top of the vertical furnace. The high-temperature semicoke cooling device based on the air distributor structure is relatively thorough in cooling and good in effect because the high-temperature semicoke is conveyed by use of the bed layer of the air distributor structure and cooled by use of air; the bed layer of the structure of a plurality of air distributors is formed into the airtight multilayer thin vertical furnace which is high in heat exchange efficiency, and the production process is safe and environmental friendly.