Inorganic filler coated by molybdenum compound, and application thereof

The invention relates to inorganic filler coated by a molybdenum compound, and an application thereof. The inorganic filler coated by a molybdenum compound is suitable for being added in a laminated board or a pre-preg material and manufacturing a printed circuit board with relatively low thermal ex...

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Bibliographische Detailangaben
Hauptverfasser:	FENG DIANRUN, ZHAO JIAZHENG, LIAO DECHAO, CHEN HAOSHENG
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention relates to inorganic filler coated by a molybdenum compound, and an application thereof. The inorganic filler coated by a molybdenum compound is suitable for being added in a laminated board or a pre-preg material and manufacturing a printed circuit board with relatively low thermal expansion coefficient. An additional amount can be increased to 20-80 wt% of a total weight of components composing the laminated board or a pre-preg material resin, without influencing drilling processability, hole position accuracy and solder heat resistance of the printed circuit board.