A test structure for a flip chip, the flip chip and a manufacturing method thereof

The invention provides a test structure for a flip chip, the flip chip and a manufacturing method thereof. The test structure for the flip chip which comprises a die and a package substrate, comprises one or more via chain structures which are provided within the die; a plurality of electrical connection units which are provided on a functional surface of the die and connected to the via chain structures, wherein the plurality of electrical connection units are connected together in series by the via chain structures; two test wires which are fixed on the package substrate and are respectively connected to the electrical connection units located in the beginning and end positions in an one-to-one correspondence. The test structure for the flip chip is capable of simultaneously testing both package effect and whether a warpage or leakage occurs in the die after the die's package, not only realizes an accurate monitoring of the flip chip yield but also improves the testing efficiency.