Flip-over type forming device for electronic device pins

The embodiment of the invention discloses a flip-over type forming device for electronic device pins. The flip-over type forming device comprises a pressing die, a die platform, a material pressing frame and a positioning device. The pressing die is connected with the die platform in an opening and closing mode; the material pressing frame is rotationally arranged between the pressing die and the die platform; the die platform is provided with containing grooves for sealing bodies of an electronic device; a positioning mechanism comprises pressing strips and positioning corners, the pressing strips are arranged at the bottom of the material pressing frame and correspond to the containing grooves, and the positioning corners are arranged on the die platform and used for positioning raw material pieces; the edges on the two sides of the containing grooves are matched with the pressing die to form the electronic device pins in a punched mode. By the adoption of the flip-over type forming device, flip-over type punch forming is carried out on the electronic device pins through the containing grooves and the pressing die, so that the heights of the pins are uniform; the pressing die is easy to maintain, as the positioning mechanism is adopted, the raw material pieces are accurately positioned, and the rate of finished products is increased; the finished products formed in the punched mode are automatically collected in a tube through a blowing device and a tube entering device, and manual operation is reduced.