Polyimide layer-containing flexible substrate, polyimide layer-containing substrate for flexible solar cell, flexible solar cell, and method for producing same

Provided is a flexible substrate which can be used for multiple purposes, which has heat resistance in that it is capable of withstanding a high temperature such as during sintering of the photoelectric conversion layer of a compound-based thin-film solar cell and with which it is possible to preven...

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Bibliographische Detailangaben
Hauptverfasser:	NAGASAKI SHUJI, HATTORI KOUICHI, OHTA TAKUHEI, TERASHIMA SHINICHI, KUROSAKI MASAO, TANAKA MASAMOTO, MIZUYAMA ATSUSHI, SUDA HIDEAKI, HIRAISHI KATSUFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a flexible substrate which can be used for multiple purposes, which has heat resistance in that it is capable of withstanding a high temperature such as during sintering of the photoelectric conversion layer of a compound-based thin-film solar cell and with which it is possible to prevent metal penetration and diffusion in the photoelectric conversion layer. In the present invention, a polyimide layer-containing flexible substrate is obtained by forming a polyimide layer having a layer thickness of 1.5-100 [mu]m and a glass transition point temperature of 300-450oC on a metal substrate that is a metal foil of ordinary steel or stainless steel having a thermal expansion coefficient in the plane direction of 15 ppm/K or less, or on a metal substrate having, on the surface of a metal foil of ordinary steel or stainless steel, a metal layer formed from one selected from the group consisting of copper, nickel, zinc, and aluminum, or an alloy layer of those.