MCM packaging type power module and method for manufacturing MCM packaging type power module

The invention discloses an MCM packaging type power module and a method for manufacturing the MCM packaging type power module. The MCM packaging type power module comprises an RCC circuit, a shell and a cover plate, wherein one end of the shell is open, and the cover plate and the shell are welded t...

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Bibliographische Detailangaben
Hauptverfasser:	YU SHIQIANG, NIU TINGJU, YU HUIQING, XU XIANZENG
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention discloses an MCM packaging type power module and a method for manufacturing the MCM packaging type power module. The MCM packaging type power module comprises an RCC circuit, a shell and a cover plate, wherein one end of the shell is open, and the cover plate and the shell are welded through parallel seam welding, so that airtight packaging between the shell and the cover plate is achieved; a ceramic substrate is arranged in the shell, all elements of the RCC circuit and chips are assembled on the ceramic substrate, and all the chips are unpacked chips and are arranged on the ceramic substrate; all signal ends of the RCC circuit are connected with the corresponding bonding pads on the ceramic substrate, and all pins penetrate through the cover plate. According to the method for manufacturing the MCM packaging type power module, the size of the power module is reduced, airtight packaging is achieved, in this way, the application range is wide, and transplantation is convenient and rapid.