High-performance microcrystalline panel for induction cooker and induction cooker

The invention relates to the field of induction cookers, and discloses a high-performance microcrystalline panel for an induction cooker and the induction cooker. The high-performance microcrystalline panel comprises a base plate, wherein a heat-insulation plate the outer contour of which can cover the whole heating region and which is made of a heat-insulation material is embedded in the base plate; a through hole is formed in the center of the heat-insulation plate, and is filled with a heat-conduction material; the size of the through hole is smaller than or equal to that of a temperature sensing bag of a cooker face. The high-performance microcrystalline panel is arranged on the induction cooker disclosed by the invention. According to the high-performance microcrystalline panel, the heat-insulation plate the outer contour of which can cover the whole heating region is embedded in the base plate, the through hole is formed in the middle of the heat-insulation plate and filled with the heat-conduction material, thus the high-performance microcrystalline panel disclosed by the invention is capable of rapidly transferring heat on a pot to the temperature sensitive bag of the furnace face by virtue of the heat-conduction material, so that the temperature sensing bag of the furnace face is relatively rapid and accurate in feedback for cases such as dry fire and overhigh temperature, and thus the induction cooker is relatively good in safety performance.