Recovered large-diameter silicon polished section cutting notch machining device and method

The invention provides a recovered large-diameter silicon polished section cutting notch machining device and method. The device comprises a radian ruler arranged on an outer frame and provided with scale marks and a silicon polished section rotating device. The silicon polished section rotating device comprises a vacuum suction cup gear and a suction cup rotating assembly. The suction cup rotating assembly drives the vacuum suction cup gear to rotate so as to adjust the position of a silicon polished section notch. The method for using the device for conducting recovery cutting on a large-diameter silicon polished section includes the steps that (1) the middle position of the notch of the silicon polished section to be recovered is aligned with the zero scale mark of the radian ruler and a reference plane datum line is preliminarily located through an auxiliary ruler; (2) a flat edge sample wafer is cut along the reference plane datum line and the flat edge crystal orientation is measured through an X-ray machine; (3) a vacuum suction cup is rotated, a modified line of the reference plane datum line is accurately located according to the deviation angle of the reference plane datum line, an orientation calibration axis perpendicular to the modified line is found, and the notch is machined through a laser cutting machine. According to the method and device, the notch of the recovered silicon polished section can be accurately machined, measurement is convenient and rapid, accuracy is high, and repeatability is good.