High-density electrode array based high spatial resolution ultrasonic detector

A high-density electrode array based high spatial resolution ultrasonic detector comprises a matching layer, an array-structured piezoelectric material chip, an insulating rubber layer, a silicon pixel chip and a chip bonding circuit board. The array-structured piezoelectric material chip is composed of a single-side electrode and small array-structured piezoelectric material units, the matching layer is attached to the single-side electrode which is grounded, and the array-structured piezoelectric material units are adhered to the silicon pixel chip through the insulating rubber layer; the silicon pixel chip is fixedly installed on the chip bonding circuit board; the detector receives ultrasonic waves which are converted into nonequivalent electrical signals on the compact small piezoelectric material units of the array-structured piezoelectric material chip through the matching layer, pixels on the silicon pixel chip sense nonequivalent electrical charge via the insulating layer, the chip bonding circuit board outputs relative analog signals or digital signals to acquire three-dimension information inside to-be-detected objects. Real-time response to the ultrasonic waves is performed by adopting the silicon pixel chip, so that imaging of the detector is high in resolution and accuracy.