Miniaturization high-protection-level microprocessor protecting device
The invention discloses a miniaturization high-protection-level microprocessor protecting device which comprises an upper cover, a sealing pad, a heat conducting silica gel piece and a case. The case serves as a carrier for arranging electrical elements. The sealing pad is pasted into a groove of th...
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| creator | RAO HONG XU WANFANG HAN ZAOLIN YAO HAO CHEN HAOMIN LI PENG GUO XIAOBIN XI WEI QI MING XU GANG XU AIDONG CHEN BO CHEN QIURONG |
| description | The invention discloses a miniaturization high-protection-level microprocessor protecting device which comprises an upper cover, a sealing pad, a heat conducting silica gel piece and a case. The case serves as a carrier for arranging electrical elements. The sealing pad is pasted into a groove of the upper cover through adhesive and has the sealing effect. The heat conducting silica gel piece is pasted on a heat dissipating element and transfers heat to the upper cover. The case is provided with aviation plugs serving as external output interfaces. The case and the upper cover are made of duralumin materials. The protecting device has the advantages of being simple in structure, reliable in performance, easy and convenient to install, low in cost, detachable and maintainable; in addition, the uniformity of product performance is ensured, and the protecting device is more suitable for batch productization production. |
| format | Patent |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Miniaturization high-protection-level microprocessor protecting device |
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