Miniaturization high-protection-level microprocessor protecting device

The invention discloses a miniaturization high-protection-level microprocessor protecting device which comprises an upper cover, a sealing pad, a heat conducting silica gel piece and a case. The case serves as a carrier for arranging electrical elements. The sealing pad is pasted into a groove of th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	RAO HONG, XU WANFANG, HAN ZAOLIN, YAO HAO, CHEN HAOMIN, LI PENG, GUO XIAOBIN, XI WEI, QI MING, XU GANG, XU AIDONG, CHEN BO, CHEN QIURONG
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention discloses a miniaturization high-protection-level microprocessor protecting device which comprises an upper cover, a sealing pad, a heat conducting silica gel piece and a case. The case serves as a carrier for arranging electrical elements. The sealing pad is pasted into a groove of the upper cover through adhesive and has the sealing effect. The heat conducting silica gel piece is pasted on a heat dissipating element and transfers heat to the upper cover. The case is provided with aviation plugs serving as external output interfaces. The case and the upper cover are made of duralumin materials. The protecting device has the advantages of being simple in structure, reliable in performance, easy and convenient to install, low in cost, detachable and maintainable; in addition, the uniformity of product performance is ensured, and the protecting device is more suitable for batch productization production.