Metal framework and electrostatic discharging ring integrated structure for fingerprint sensor and manufacturing method thereof
The invention relates to a metal framework and electrostatic discharging ring integrated structure for a fingerprint sensor and a manufacturing method of the metal framework and electrostatic discharging ring integrated structure. The metal framework and electrostatic discharging ring integrated str...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention relates to a metal framework and electrostatic discharging ring integrated structure for a fingerprint sensor and a manufacturing method of the metal framework and electrostatic discharging ring integrated structure. The metal framework and electrostatic discharging ring integrated structure comprises a metal framework (1), wherein a groove is formed in the front side of the metal framework (1), an electrostatic discharging ring (10) is arranged on the periphery of the groove, a base island (2) and a pin (3) are arranged in the groove, the base island (2) comprises an upper base island portion and a lower base island portion, the pin (3) comprises an upper pin portion and a lower pin portion, a sensing chip (5) is arranged on the front side of the upper portion of the base island through chip mounting glue (4), and the front side of the sensing chip (5) is connected with the front side of the upper portion of the pin through a metal bonding wire (6). The metal framework and electrostatic discharging ring integrated structure for the fingerprint sensor and the manufacturing method of the metal framework and electrostatic discharging ring integrated structure have the advantages that the electrostatic discharging ring and the metal framework are of the integrated structure, the manufacturing technology is simple, the problem of position offset caused when a traditional electrostatic discharging ring is assembled to a framework is avoided, the matching accuracy of the positions of the electrostatic discharging ring and the sensing chip is improved, and thus the recognition effect of the sensing chip is improved. |
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