Micro-surface adhesion energy measuring method

The invention provides a micro-surface adhesion energy measuring method. According to the method, a stretching instrument is used for stretching a chip to where a double-ended clamped beam is adhered, and tensile stress is introduced into the beam, so that the structural rigidity of the beam is incr...

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1. Verfasser: TU CHENFENG
Format: Patent
Sprache:eng
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Zusammenfassung:The invention provides a micro-surface adhesion energy measuring method. According to the method, a stretching instrument is used for stretching a chip to where a double-ended clamped beam is adhered, and tensile stress is introduced into the beam, so that the structural rigidity of the beam is increased to overcome adhesion elevation until adhesion removal. The corresponding relation between the stretching force and the adhesion appearance is observed and can be taken as reference for measuring and studying surface adhesion energy. Compared with the traditional adhesion energy measuring method, the method has the advantages of simplicity, flexibility, high resolution, area saving, good repeatability and the like.