Wiring board
The invention provides a wiring board. The wiring board A includes an insulating layer 3 having a lower layer conductor 5 on a lower surface thereof, a plurality of semiconductor element connection pads 10 arranged in a lattice pattern in a semiconductor element mounting portion 1a having a quadrang...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention provides a wiring board. The wiring board A includes an insulating layer 3 having a lower layer conductor 5 on a lower surface thereof, a plurality of semiconductor element connection pads 10 arranged in a lattice pattern in a semiconductor element mounting portion 1a having a quadrangular shape on the insulating layer 3, a via hole 7a formed in the insulating layer 3 below each of the semiconductor element connection pads 10, and a via conductor 9a filled in the via hole 7a and formed integrally with each of the semiconductor element connection pads 10. The wiring board includes a reinforcing via hole 7b formed in the insulating layer 3 in an outer region outside an arrangement region 1b of the semiconductor element connection pads 10 in corner portions of the semiconductor element mounting portion, and a reinforcing via conductor 9b formed in the reinforcing via hole 7b. |
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