SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

The invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device includes a first semiconductor electronic component which includes a pad electrode, a solder bump, and a metal layer between a pad and solder that is configured to have an underlying metal la...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KATSUJI MATSUMOTO, HIIZU OOTORII
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device includes a first semiconductor electronic component which includes a pad electrode, a solder bump, and a metal layer between a pad and solder that is configured to have an underlying metal layer formed between the pad electrode and the solder bump and connected to the pad electrode, and a main metal layer formed on the underlying metal layer, and in which the main metal layer has an eave portion at an outer edge portion thereof. Accordingly, the invention prevents the reduction in the reliability of electrical connection and mechanical connection between the semiconductor electronic components while suppressing a decrease in the mass production rate and an increase in the cost.