Palladium mesh alloy wire without plating thereon and method for manufacturing the same

The invention relates to a palladium mesh alloy wire without plating thereon and a method for manufacturing the same. The manufacturing method comprises the steps of: plating a palladium layer with the thickness of 5-120nm on a surface of a silver baseline, heating it up to 600-800 DEG C and maintaining the temperature for not more than 4 hours so that palladium on the surface is completely thermally diffused to a grain boundary grid surface of the silver baseline, thereby forming a grain-boundary band containing palladium. The palladium mesh alloy wire without plating thereon is prepared by the abovementioned method, and consists of the silver base and the grain-boundary band containing palladium. Compared with a known silver series bonding wire, the palladium mesh alloy wire in the invention has better hardness of a ball part, neck strength and fusing current density, and more particularly, has excellent weather resistance. The palladium mesh alloy wire without plating thereon in the invention can be applie