Ultrasonic vibration machining method of small-diameter deep hole of microwave deterring material

The invention relates to an ultrasonic vibration machining method of a small-diameter deep hole of a microwave deterring material. The method includes establishing a microwave deterring material ultrasonic-vibration hole machining system, setting the speed of a lathe electrical spindle to be n, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JIA WENZHENG, BIAN YUZHU, SHI XINGKUAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to an ultrasonic vibration machining method of a small-diameter deep hole of a microwave deterring material. The method includes establishing a microwave deterring material ultrasonic-vibration hole machining system, setting the speed of a lathe electrical spindle to be n, and setting the parameters f and A of ultrasonic power supply; machining the small-diameter deep hole of the microwave deterring material; switching off the lathe spindle and the ultrasonic power supply, and fetching a pieceworker. By the aid of the method, the problems that waste rate is high, cutter is worn fast, the size accuracy is low and machining cost is high can be solved, and the machining efficiency and quality of the small-diameter deep hole of parts of the material can be realized.