SUPERCONDUCTING WIRE AND METHOD OF FORMING THE SAM
Provided is a method of forming a superconducting wire. In the method, a buffer layer is formed on a substrate. Then, a superconducting precursor film is formed on the substrate formed with the pinning seed layer. Thereafter, the substrate formed with the superconducting precursor film is heat-treat...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Provided is a method of forming a superconducting wire. In the method, a buffer layer is formed on a substrate. Then, a superconducting precursor film is formed on the substrate formed with the pinning seed layer. Thereafter, the substrate formed with the superconducting precursor film is heat-treated to form a superconducting film including magnetic flux pinning centers on the substrate. The magnetic flux pinning centers comprise at least one element included in the pinning seed layer, and at least one element included in the superconducting precursor film. |
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