Thermally conductive, moisture-curable resin composition

The present invention relates to a thermally conductive, moisture-curable composition capable of efficiently conducting heat for components that involve heat generation. The present invention relates to a thermally conductive, moisture curable resin composition comprising (A) an organic polymer cont...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUKI TAKASHI, MAEDA YASUO, FUJISAWA TSUNETOSHI, ADACHI MAMORU, IDE MIYOKA, MOTOKI SHIGEKAZU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention relates to a thermally conductive, moisture-curable composition capable of efficiently conducting heat for components that involve heat generation. The present invention relates to a thermally conductive, moisture curable resin composition comprising (A) an organic polymer containing two or more cross-linkable hydrolyzable silyl groups, (B) a thermally conductive filler, and (C) a polyether compound having a cross-linkable hydrolyzable silyl group at only one terminal.