Heat radiation structure of electric device and method for manufacturing the same

A heat radiation structure for an electric device (Qa-Qd,16) includes: at least one multi-layer substrate (12,12A,12B) including a plurality of base parts (121-125) made of insulation material and a conductor pattern (12c), which are stacked in a multi-layer structure so that the conductor pattern i...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIMICHI HARA, TOSHIHISA YAMAMOTO, YUUJI KOBAYASHI, TAKAHIRO YAMANAKA, KOUJI KAMEYAMA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A heat radiation structure for an electric device (Qa-Qd,16) includes: at least one multi-layer substrate (12,12A,12B) including a plurality of base parts (121-125) made of insulation material and a conductor pattern (12c), which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion (L1-L10) in the base parts; the electric device having at least one of a first electric element (Qa-Qd) built in the at least one multi-layer substrate and a second electric element (16), which is not built in the multi-layer substrate; and a low heat resistance element (13) opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material.