Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device

A method of integrating benzocyclobutene (BCB) layers with a substrate is provided along with a corresponding device. A method includes forming a first BCB layer (18a) on the substrate (12) and depositing a first metal layer (20a) on the first BCB layer (18a) and within vias defined by the first metal layer (20a). The method also forms a second BCB layer (18b) on the first metal layer (20a) and deposits a second metal layer (20b) on the second BCB layer (18b) and within vias defined by the second metal layer (20b). The second metal layer (20b) extends through the vias defined by the second metal layer (20b) to establish an operable connection with the first metal layer (20a). The first and second metal layers (20a, 20b) are independent of an electrical connection to any circuit element carried by the substrate (1w), but the first and second metal layers (20a, 20b) secure the second BCB layer (18b) to the underlying structure and reduce the likelihood of delamination.