Process for manufacturing an encapsulating device

Process for manufacturing an encapsulating device

The invention relates to an element (2, 4, 44, 64) arranged to interact with another part (4, 2) in order to form an encapsulating device (3) for a component (5) comprising the element (2, 4) at least partially coated with a metallization (11, 9, 49, 69). According to the invention, said metallizati...

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Hauptverfasser: DEILLON LEA, DALLA PIAZZA SILVIO, HESSLER THIERRY
Format: Patent
Sprache:chi ; eng
Schlagworte:
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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creator DEILLON LEA
DALLA PIAZZA SILVIO
HESSLER THIERRY
description The invention relates to an element (2, 4, 44, 64) arranged to interact with another part (4, 2) in order to form an encapsulating device (3) for a component (5) comprising the element (2, 4) at least partially coated with a metallization (11, 9, 49, 69). According to the invention, said metallization comprises at least one metal layer (15) protected by an intermetallic compound (19, 59, 79) which is covered by a non-diffused portion (12', 52', 72') of a material the melting point of which is below 250 DEG C. The invention also relates to a process (21) for manufacturing an encapsulating device (3).
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subjects MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
title Process for manufacturing an encapsulating device
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