Process for manufacturing an encapsulating device
The invention relates to an element (2, 4, 44, 64) arranged to interact with another part (4, 2) in order to form an encapsulating device (3) for a component (5) comprising the element (2, 4) at least partially coated with a metallization (11, 9, 49, 69). According to the invention, said metallizati...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to an element (2, 4, 44, 64) arranged to interact with another part (4, 2) in order to form an encapsulating device (3) for a component (5) comprising the element (2, 4) at least partially coated with a metallization (11, 9, 49, 69). According to the invention, said metallization comprises at least one metal layer (15) protected by an intermetallic compound (19, 59, 79) which is covered by a non-diffused portion (12', 52', 72') of a material the melting point of which is below 250 DEG C. The invention also relates to a process (21) for manufacturing an encapsulating device (3). |
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