Radio frequency package on package circuit

Radio frequency package on package circuit

A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package (306). The first radio frequency package includes radio frequency components (310, 312, 314, 316). The radio frequency package on package (Po...

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Bibliographische Detailangaben
Hauptverfasser: SAHOTA GURKANWAL SINGH, SHAH MILIND P, WILDING DAVID J, HOLENSTEIN CHRISTIAN, HADJICHRISTOS ARISTOTELE, CICCARELLI STEVEN C, LANE RYAN D
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package (306). The first radio frequency package includes radio frequency components (310, 312, 314, 316). The radio frequency package on package (PoP) circuit also includes a second radio frequency package (308). The second radio frequency package includes radio frequency components (322, 324). The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.