Workpiece polishing device and method

The invention discloses a workpiece polishing device and method. The device comprises a guiderail mechanism, a plurality of polishing cutter components, a drive mechanism, a limit mechanism, a discharge plate, a waste hopper, a frame and a working base plate. The guiderail mechanism, the drive mechanism, the limit mechanism and the discharge plate are respectively mounted on the upper plane of the working base plate. The waste hopper is located on the lower portion of the working base plate which is disposed on the frame. The drive mechanism is of a sealed annular structure. The guiderail mechanism is located outside the drive mechanism. The limit mechanism is located inside the drive mechanism. The polishing cutter components are mounted on the guiderail mechanism. The method includes: a robot moves workpieces to the workpiece polishing device; the limit mechanism limits the positions of the workpieces; the drive mechanism drives the polishing cutter components to move along the guiderail to polish the workp