LED packaging substrate and LED packaging structure

The invention discloses an LED packaging substrate and an LED packaging structure adopting the substrate. The substrate in the invention is of metal (such as aluminum, copper) or ceramic material, an upper surface of the substrate is provided with a reflective structure and a chip slot, the reflecti...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG HUIDONG, FENG WEI, SUN XIQING, ZHANG YANWEI, LIU KAI, ZHAO LELING
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses an LED packaging substrate and an LED packaging structure adopting the substrate. The substrate in the invention is of metal (such as aluminum, copper) or ceramic material, an upper surface of the substrate is provided with a reflective structure and a chip slot, the reflective structure of the upper surface of the substrate is reflected as two segments of disconnected arc-shaped structures in a top view, the chip slot is used for placing an LED chip and filling fluorescent glue, and the reflective structure is located outside the chip slot; and the reflective structure of the upper surface of the substrate adjusts the direction of a portion of light through reflection, further adjusts spatial light intensity distribution, thereby decreasing beam angles of some directions, or enabling light to lean to one side, and light color uniformity of light spots can be improved.