Electroplating method

The invention provides an electroplating method. The electroplating method is characterized by providing a circuit substrate on which a circuit layer is formed and a part of which is exposed out of the circuit layer, forming an electroplating seed layer, which covers the circuit layer and the part of the circuit substrate exposed out of the circuit layer, on the circuit substrate, forming a photoresist layer, which enables a part of the electroplating seed layer to be exposed, on the electroplating seed layer, removing a part of the electroplating seed layer which is not covered with the photoresist layer to expose a part of the circuit layer, and electroplating a surface protecting layer on a part of the circuit layer taking the photoresist layer as an electroplating mask.