Substrate structure and manufacturing method thereof

The invention discloses a substrate structure and a manufacturing method thereof. The substrate structure comprises an insulation base material and a through hole, wherein the through hole penetrates through the insulation base material and is provided with a first opening, a second opening and a th...

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Bibliographische Detailangaben
1. Verfasser:	LIANG SHUNXIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention discloses a substrate structure and a manufacturing method thereof. The substrate structure comprises an insulation base material and a through hole, wherein the through hole penetrates through the insulation base material and is provided with a first opening, a second opening and a third opening which are mutually communicated, the third opening is located between the first opening and the second opening, a first included angle is formed between the inner wall of the first opening and the inner wall of the third opening, a second included angle is formed between the inner wall of the second opening and the inner wall of the third opening, the smallest diameter of the third opening is located in the middle of the through hole, a necking end is defined, and both the diameter of the first opening and the diameter of the second opening become smaller gradually towards the necking end.