Bump-equipped electronic component and method for manufacturing bump-equipped electronic component

The purpose of the present invention is to provide a bump-equipped electronic component and a method for manufacturing a bump-equipped electronic component. The bump-equipped electronic component and the method for manufacturing the bump-equipped electronic component are used for preventing changes...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISAO OBU, SHINYA OSAKABE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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