Bump-equipped electronic component and method for manufacturing bump-equipped electronic component

The purpose of the present invention is to provide a bump-equipped electronic component and a method for manufacturing a bump-equipped electronic component. The bump-equipped electronic component and the method for manufacturing the bump-equipped electronic component are used for preventing changes in characteristics of semiconductor chips and failure of a connection between a semiconductor substrate and a mounting substrate. The bump-equipped electronic component includes a circuit substrate (1) and first and second bumps (B1, B2) which are disposed on a principal surface of the circuit substrate (1) and have different cross-sectional areas in a direction parallel or substantially parallel to the principal surface. Furthermore, one (B1) of the first and second bumps (B1, B2) having a smaller cross-sectional area includes a height adjustment layer (5) disposed in a direction perpendicular or substantially perpendicular to the principal surface.