The printed circuit board manufacturing method
A method for minimizing the thickness of a flexible printed circuit board with a copper plating part is provided to improve the flexibility of the printed circuit board by reducing deviation between a plated part and a part which is not plated. The method comprises the following processes: a hole pr...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A method for minimizing the thickness of a flexible printed circuit board with a copper plating part is provided to improve the flexibility of the printed circuit board by reducing deviation between a plated part and a part which is not plated. The method comprises the following processes: a hole processing process (S10), a chemical copper plating process (S20), a laminating process (S30), an exposure process (S40), a development process (S50), a partial plating process (S60); a dry film separating process (S70); and a plating sanding process (S80). |
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