Solvent-free wire enamel composition

The invention relates to a solvent-free wire enamel composition containing extrudable binders containing polyesterimide, produced from polyols, polycarboxylic acids, imide-forming components, and structural elements, which can be cross-linked after the extrusion.

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Bibliographische Detailangaben
Hauptverfasser:	LIENERT KLAUS-W, TOEDTER-KOENIG SASCHA, ROST SIMON, HARTKOPP STEFAN, HALFAR RONNIE, MORITZ HANS-ULRICH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention relates to a solvent-free wire enamel composition containing extrudable binders containing polyesterimide, produced from polyols, polycarboxylic acids, imide-forming components, and structural elements, which can be cross-linked after the extrusion.