Radio frequency identification integrated circuit with large contact plate

A radio frequency identification integrated circuit with a large contact plate. A RFID integrated circuit having a re-passivation layer and a conductive redistribution layer can be assembled on a base board through an additional layer. The additional layer comprises one or more etching agent so as t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RONALD A. OLIVER, CHRISTOPHER J.DIORIO, RONALD LEE KOEPP, JAIDEEP MAVOORI, TAN MAU WU, HARLEY HEINRICH
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A radio frequency identification integrated circuit with a large contact plate. A RFID integrated circuit having a re-passivation layer and a conductive redistribution layer can be assembled on a base board through an additional layer. The additional layer comprises one or more etching agent so as to form a notch on a non-conductive barrier layer between the assembly and the base board, and also comprises an adhesive so as to bonding the assembly to the base board.