Radio frequency identification integrated circuit with large contact plate
A radio frequency identification integrated circuit with a large contact plate. A RFID integrated circuit having a re-passivation layer and a conductive redistribution layer can be assembled on a base board through an additional layer. The additional layer comprises one or more etching agent so as t...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A radio frequency identification integrated circuit with a large contact plate. A RFID integrated circuit having a re-passivation layer and a conductive redistribution layer can be assembled on a base board through an additional layer. The additional layer comprises one or more etching agent so as to form a notch on a non-conductive barrier layer between the assembly and the base board, and also comprises an adhesive so as to bonding the assembly to the base board. |
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