Butyl hot melt adhesive

The invention discloses a butyl hot melt adhesive. The butyl hot melt adhesive is prepared from the following raw materials in parts by weight: 50-60 parts of butyl rubber, 6-10 parts of polyisobutylene, 20-30 parts of hydrogenated rosin resin, 3-5 parts of vinyl carboxylate, 4-6 parts of oleic acid...

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Bibliographische Detailangaben
1. Verfasser:	FANG JUPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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