Butyl hot melt adhesive

The invention discloses a butyl hot melt adhesive. The butyl hot melt adhesive is prepared from the following raw materials in parts by weight: 50-60 parts of butyl rubber, 6-10 parts of polyisobutylene, 20-30 parts of hydrogenated rosin resin, 3-5 parts of vinyl carboxylate, 4-6 parts of oleic acid polyoxyethylene ester, 1-2 parts of polybenzimidazole, 1-2 parts of sodium fluosilicate, 1-2 parts of alkyl phosphate diethanolamine salt, 0.1-0.2 part of 8-copper quinolinate, 1-2 parts of monopotassium phosphate, 0.1-0.3 part of dibasic lead phosphite, 1-2 parts of metaboric acid ammonium and 12-16 parts of thickening agent. The butyl hot melt adhesive disclosed by the invention has good adhesive force and peel strength, excellent mechanical property and good combination property and is particularly suitable for bonding of glass.