Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

Methods for removing, reducing or treating the trace metal contaminants and the smaller fine sized cerium oxide particles from cerium oxide particles, cerium oxide slurry or chemical mechanical polishing (CMP) compositions for Shallow Trench Isolation (STI) process are applied. The treated chemical...

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Bibliographische Detailangaben

Hauptverfasser:	JOHN ANTHONY MARSELLA, JO-ANN THERESA SCHWARTZ, STEVEN CHARLES WINCHESTER, SAIFI USMANI, XIAOBO SHI, LAURA LEDE NBACH, JAE OUK CHOO, JAMES ALLEN SCHLUETER, JOHN EDWARD QUINCY HUGHES, HONGJUN ZHOU, DANIEL HERNANDEZ CASTILLO, II
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS DYES INORGANIC CHEMISTRY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES
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