Profile cutter
The described embodiments relate generally to device housings and more particularly to methods for blending multiple surfaces of a device housing during a machining process. A method is disclosed that prevents the formation of steps and allows for a smooth transition between flat and curved surfaces...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!