Profile cutter

The described embodiments relate generally to device housings and more particularly to methods for blending multiple surfaces of a device housing during a machining process. A method is disclosed that prevents the formation of steps and allows for a smooth transition between flat and curved surfaces...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TRZASKOS PIOTR S, COPELAND BRIAN K, HENDERSON NATHANIEL H
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The described embodiments relate generally to device housings and more particularly to methods for blending multiple surfaces of a device housing during a machining process. A method is disclosed that prevents the formation of steps and allows for a smooth transition between flat and curved surfaces by using a profile cutter with an obtuse angle. The profile cutter can extend into the area in which the flat surface is desired while angling upwards and away from the part. This angle can ensure that the boundary between the flat surfaces and curved surfaces forms a shallow peak rather than a step. A shallow peak can be relatively easier to blend during a polishing operation than a step. As a result, the boundaries between surfaces can be hidden from the user of the device and the manufacturing process can be more efficient.