Integrated circuit device and method of manufacturing same

The present invention discloses an integrated circuit device and a method for manufacturing the integrated circuit device. The disclosed method provides improved control over a surface proximity and tip depth of integrated circuit device. In an embodiment, the method achieves improved control by for...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OUYANG HUI, FAN WEIHAN, TSAI MING-HUAN, CHENG CHUN-FAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!