Circuit board

A circuit board (102) includes a dielectric layer (122) and sacrificial bumps (123) on the dielectric layer in predetermined circuit common areas (160). A conductive seed layer (124) is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductiv...

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Bibliographische Detailangaben
Hauptverfasser:	GEIGER JOHN PATTON, MALSTROM CHARLES RANDALL, MYERS MAJORIE KAY
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A circuit board (102) includes a dielectric layer (122) and sacrificial bumps (123) on the dielectric layer in predetermined circuit common areas (160). A conductive seed layer (124) is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer (124). Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate (120), with the dielectric layer applied on the metal substrate.