Connecting element for a multi-chip module, and multi-chip module
The invention relates to a connecting element (1) for a multi-chip module (10), said connecting element being provided for establishing an electrical connection between two elements (11a, 11b, 12) and having a carrier (2) and a first electrically conductive connecting structure (5) on a first main s...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a connecting element (1) for a multi-chip module (10), said connecting element being provided for establishing an electrical connection between two elements (11a, 11b, 12) and having a carrier (2) and a first electrically conductive connecting structure (5) on a first main surface (3) of the carrier (2), wherein the first connecting structure (5) is designed in such a way that said first connecting structure connects the first and second elements (11a, 11b, 12) to each other. The invention further relates to a multi-chip module (10) having such a connecting element (1) and two elements (11a, 11b, 12), wherein the two elements (11a, 11b, 12) are electrically connected to each other in a wireless manner by means of the connecting element (1). |
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