Tin-lead solder for brazing copper radiator
The invention relates to a brazing solder, in particular to a tin-lead solder for brazing a copper radiator. The tin-lead solder comprises Sn, Pb and microelements. The tin-lead solder is low in melting temperature, good in mechanical property and not high in price, and has good wettability and spre...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a brazing solder, in particular to a tin-lead solder for brazing a copper radiator. The tin-lead solder comprises Sn, Pb and microelements. The tin-lead solder is low in melting temperature, good in mechanical property and not high in price, and has good wettability and spreading performance; the brazed copper radiator is good in stability, high in welding efficiency, reliable in quality, thin and firm in weld seam, free of pseudo soldering and solder accumulation, good in performance and good in cost performance, and residues produced after welding can be easily cleaned away. |
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